Sch"after+Kirchhoff SK1024U3PD Manual de usuario Pagina 18
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TDI_ZK.indd • Page 31
Kieler Str. 212, 22525 Hamburg, Germany • Tel: +49 40 85 39 97-0 • Fax: +49 40 85 39 97-79 • [email protected] • www.SuKHamburg.com
31
11-2014 E
Application
TDI line scan camera:
Dark-field illumination
of wafer inspection
TDI line scan camera SK4096GTDI-XL with LED/dark-field illumination:
inspection of a mirrored surface for dirt and scratches
• Dark-field illumination
In industrial image processing, dark-field illu mination is particularly
useful for the examination of highly reflecting surfaces. The light
beam is directed at the surface of the test object at a low angle of
incidence, so that the light is undetected by the camera when
reflected from a perfect surface. With
an immaculate surface, the scanned
object appears completely dark.
When there are surface irregularities
caused by some damage, such as a
scratch or a crack, or some
contamination, such as dust, lint or
grease, then a small part of the incident
light is scattered diffusely, captured by
the lens and directed onto the sensor.
Tiny irregularities can be detec ted that
are even below the resolution limit of
the lens. The image may not always be
completely in focus anymore, just like
viewing a star in the night sky, but the increase in reflected light at
the sensor is still detectable.
The process of this type of image acquisition does mean that the
image produced by the dark-field illumination of a reflective surface
is quite faint. With conventional line scan cameras, substantially
longer integration times have to be used in comparison with directed
bright-field illumination (see page 52) or for image acquisition from
a diffusely reflecting object. For such low signal amplitudes, only low
line frequencies and scan velocities are possible.
The highly amplified sensitivity of TDI line scan cameras means that
they are particularly suitable for dark-field illumination problems.
They also provide much higher measurement and scan velocities for
the same absolute degree of object illumination.
• Application fields:
• Surface examination of highly reflective materials, e.g. chips,
wafers or mirrored surfaces.
• Highlighting of contours, scratches, cracks, dust particles and dirt.
Dark-field
illumination
charge transfer
TDI-Sensor
Lens
intensity
Object
Multiple
exposure of
a moving
object
VOLTA IC
Applications
D
N
A
ANALYSIS
WAFER
I
N
S
PE
C
TI
O
N
DOCUMENTS
Synchronization of Transport Speed and Line Frequency
Camera Back View and Connections
Dimensions
To utilize a TDI ca mera, it is
necessary to transport the test
object in a designated direction,
in relation to the camera (or vice
versa), and at a defined velocity
(see below). A sharp image of the
scanned object can only be
achieved when there is perfect
synchrony between the transport
speed, the exposure time and
the magnification.
The optimal transport speed is
calculated from the formula:
w
P
Âȕ
v
O
=
t
E
When the transport speed is a
given, the line frequency has to
be adjusted using:
v
o
f
L
=
w
P
Âȕ
where:
v
O
= object velocity
w
P
= pixel width
ȕ = magnification power
t
E
= exposure time
pixel 1
pixel 1
line 1
line 96
line 1
line 96
LVDS
Data
Miniature
Centronics,
male 36-pin
P1
P2
Gain/Offset
P1: Gain single /
odd
P2: Offset single/
Gain even
Power supply
via line scan
grabber
SK9193D
1
1
1
2
1
Data
Mini D
Ribbon,
female 26-pin
Power
Hirose Series 10A
male 6-pin
+ 5 V, 430 mA /
+15 V, 35 mA
2
2
1
3
4
5
6
Pin Signal
1 +15 V
2 +15 V
3 + 5 V
Pin Signal
4 +5 V
5 GND
6 GND
Data
RJ45 connector
for Gigabit Ethernet
cable CAT6
specification
2
1
3
4
5
6
2
3 1
1
2
Pin Signal
1 +15 V
2 +15 V
3 + 5 V
Pin Signal
4 +5 V
5 GND
6 GND
I/O-Connector
Hirose Series 10A,
male 12-pin
2
1
3
4
5
6
7
8
9
10
1112
3
Pin Signal
1 GND
8 FrameSync
10 LineSync
Power
Hirose Series 10A,
male 6-pin,
+5 V, 700 mA / +15 V, 50 mA
1
Data and power
USB 3.0 socket,
type μB with
threaded holes for
locking screws
3
Status indicator
off no power
red power on
green power on, firmware is
loaded, camera is ready
2
2
1
3
4
5
6
Pin Signal
1 Line Sync B
2NC
3 Frame Sync
4NC
5 Line Sync A
6 GND
Line and Frame Sync:
TTL levels
Synchronization
socket: Hirose series
10A, male 6-pin
1
2
3
The dimensions are determined by the camera casing according to
table 1, column 13. For dimensions and drawings, see pages 58–60.
For 4096 x 96 pixel cameras, also see XL-Series section, page 36.
Example: Round housing, M40x0.75 lens mount
AT2
USB 3.0 interface
AC2
Camera Link interface
AL2
LVDS interface
Pixel 1
M3 (4x)
depth 6.5 mm
54Ø65
M40x0.75
2.5
6
FFL
41.7
Ø42
12.7
Seat for bracket: Ø42 mm
Flange focal length: FFL = 19.5 mm
CCD-Sensor
- Line Scan Cameras 1
- GigE line scan camera 2
- Software SK91GigE-WIN 3
- Area scan 4
- Software 4
- Line scan 4
- 34/M4/4x90° 5
- Pin Signal Pin Signal 8
- 1 Line Sync B 4 +5 V * 8
- 2 +15 V * 5 Line Sync A 8
- 3 Frame Sync 6 GND 8
- USB3_ZK.indd • Page 22 9
- Specialized application 10
- CamLink_ZK.indd • Page 25 12
- Application 14
- Line Scan Cameras 16
- TDI Line Scan Cameras 17
- Application 18
- Interface 19
- G1 G2 G3 G4 20
- B1 R2 B2R1 20
- B1R1 G12 B2R2 G34 20
- 11-2014 E 21
- White balance 21
- Color correction 21
- Plug Scanner 22
- SK-2096-USB3-Color 22
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